Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review

Chemical mechanical polishing (CMP) is an essential planarization process for semiconductor manufacturing. The application of CMP has been increasing in fabrication highly integrated devices. Recently, environmental burden caused by the was assessed because interest global environment. In this study, previously reported impacts on environment and studies conducted developing various methods to reduce are reviewed. addition analyzing CMP, paper introduces a method treating wastewater improving material removal efficiency through improvement consumables. Finally, authors review research hybridization discuss direction which technology will progress improve sustainability future.